Научная электронная библиотека ULRICH'S Periodicals Directory

Сибирский государственный университет
науки и технологий имени академика М.Ф. Решетнева

Сибирский аэрокосмический журнал
ISSN 2712-8970 (Print) ISSN 2782-5760 (on-line)

Сведения об образовательной организации

UDK 539.3
APPLICATION OF ACOUSTIC EMISSION TESTING FOR SOLDER ATTACHMENT ELECTRONICS
A. V. Azin [1], N. N. Marickiy [1], S. A. Ponomarev [1], S. V. Ponomarev [1], S. B. Suncov [2]
[1] Tomsk State University 36, Lenina Av., Tomsk, 634050, Russian Federation E-mail: antonazin@mail.ru [2] JSC "Information satellite systems” named after academician M. F. Reshetnev" 52, Lenin str., Zheleznogorsk, Krasnoyarsk region, 662972, Russian Federation E-mail: sbsun@iss-reshetnev.ru
Modern high-precision electronic equipment, which is a part of space technology, is expensive to manufacture due to the import component base and small series production. The paper examines existing methods of monitoring the quality of the electronics, which provides the performance and durability of the active presence of a spacecraft. The effectiveness of the method of acoustic emission for tracking the appearance of defects in solder joints of printed circuit boards of the electronics in real time. Relevance of the work is necessary for further development of the non-destructive method of detecting defects and sites of their localization, and their classification according to the degree of danger to the operation of the module of the electronics. In operation, a method of specification the defect locating using the method of acoustic emission has been developed. The accuracy of the method to localize the defect consists of 1 mm. On the standard case of the microchip in 1 mm increments probability defective contact is 95 %. On the basis of these experiments, a model of damage accumulation of the object (solder terminal connections of the chip housing of printed circuit boards of the electronics), which adequately reflects its properties has been constructed. The resulting behavior of a model of damage accumulation displays this object is not less than 80 % of the planned service life. The results of experimental studies of the diagram obtained accumulation of acoustic signals from developing defects in the process of deformation of the solder joint, determine the accuracy of the method, the parameters of a model of damage accumulation in the solder joint and the inception of the defects in the process of mechanical action. It demonstrates the promising applications of the method of acoustic emission for inspection of printed circuit boards. Sharing of X-ray tomography and the method of acoustic emission monitoring, which will be at the stage of preliminary processing and the production of printed circuit boards with high accuracy to predict the duration of their reliable operation is substantiated.
acoustic emission, X-ray method, inspection, solder joints, reliability, electronic equipment.
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Azin Anton Vladimirovich – Cand. Sc., junior research fellow, National Research Tomsk State University. E-mail: antonazin@ niipmm.tsu.ru

Maritskiy Nikolai Nikolaevich – Cand. Sc., junior research fellow, National Research Tomsk State University. E-mail: evilelf_84@mail.ru

Ponomarev Sergey Alexandrovich – junior research fellow, National Research Tomsk State University. E-mail: doc.sergeyponomarev@gmail.ru

Suntsov Sergei Borisovich – Cand. Sc., head of avionics department, JSC “Information satellite systems” named after academician M. F. Reshetnev”. E-mail: sbsun@iss-reshetnev.ru